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9 04/00 1 inductive components for electronic equipment especially in this age of fully-electronic and highly-integrated equipment, inductive components are indispensable. they are used to store energy intermittently in switch-mode power supplies and dc/dc converters, as parts of high-frequency circuits, as filter elements and last but not least as interference suppression components to ensure emc. of course, the demands placed on inductors depend on how and where they are to be used. in hf circuits, coils with high quality factors and resonance frequencies are needed. in emc applications, high inductances are required in order to achieve good interference suppression characteristics, low q factors being more desirable here due to the need to avoid resonances. epcos provides suitable inductive components for all applications. this data book contains a wide selection of standard components, from smt types (starting with simid 0402) right up to the 4-line high-current inductors for power electronics applications. attention is drawn to the excellent hf characteristics and the extremely high reliability of the com- ponents, achieved thanks to large-scale production automation and many years of experience in the manufacture of this kind of components. an overview of typical applications for inductors and chokes 1.1 hf circuits smt styles (simid product range) and leaded rf chokes are especially suitable for rf and other high-frequency circuits. typical applications are resonant circuits and frequency-selective filters of the type being increasingly used in telecommunications engineering and automotive electronics. in some cases, special demands on the inductive components arise, for example, when used in trans- mitter output circuits of mobile telephones (high q factors and resonance frequencies) and in air- bag control circuits (high pulse currents). 1.2 filter circuits when inductive components are used for filters in power supplies for electronics, high inductances, the lowest possible dc resistance and a low q factor are required. the impedance should have a wide- band frequency characteristic. in addition to the current rating, the maximum permissible pulse current (switching transient currents) and adequately high core material saturation are of importance. chokes belonging to all type series presented here can be used for this range of applications, from the simid types right up to chokes with powder cores and one or two lines. application inductance current rating resonance frequency q factor dc resistance hf circuits, resonant circuits low low very high very high low emc high * high low very low filter circuits high high high low very low switch-mode power supplies, dc/dc converters ** medium high low * depends on the specific application general technical information
10 04/00 1.3 switch-mode power supplies, dc/dc converters inductive components are used for magnetic energy storage in all kinds of switch-mode power sup- plies and dc/dc converters. for example, the simid 1812 product range is used in low-power step- up converters in automobile electronics and in battery-powered equipment. they can be subjected for short periods to currents which are the quadruple of their current rating without any saturation effects occurring. 1.4 emc applications for broadband interference suppression, current-compensated chokes with ring cores or d cores and powder core chokes are especially suitable. apart from use as filters in mains and other power supply lines, such chokes are important for data lines as used in telecommunications engineering, e. g. in ntbas (network termination basic ac- cess units, isdn), in line cards in telephone exchanges (isdn and analog) and in the fast-expand- ing can bus application field (can = controller area network) in automotive electronics. almost all the component families are approved in accordance with the main international stan- dards. all chokes for low-frequency mains networks are dimensioned and tested in compliance with the applicable en and iec standards. inductive components with particularly good rf characteristics are achieved by the use of ungapped cores. the manufacturing methods developed by epcos lead to good reproducibility of the attenua- tion characteristics and enable the production of high-quality components at a favorable price. the companys many years of experience guarantee that customers quickly and economically ob- tain just the right solutions to their emc problems. our own emc laboratory in regensburg or one of our european emc partner laboratories is at your disposal at all times to help with professional advice and in carrying out measurements (also refer to the chapter on services ). 1.4.1 propagation of interference interference voltages and currents can be grouped into common-mode interference, differential- mode interference and unsymmetrical interference: n common-mode interference (asymmetrical interference): C occurs between all lines in a cable and reference potential ( fig. 1a ), C occurs mainly at high frequencies (from approximately 1 mhz upwards). n differential-mode interference (symmetrical interference): C occurs between two lines (l-l, l-n) ( fig. 1b ), C occurs mainly at low frequencies (up to several hundred khz). ssb1465-p asymmetrische ausbreitung symmetrische ausbreitung unsymmetrische ausbreitung as u s u us1 u us2 u 1a 1b 1c fig. 1 propagation modes asymmetrical propagation symmetrical propagation unsymmetrical propagation ssb1465-p u = v = voltage general technical information
11 04/00 n unsymmetrical interference: C this term is used to describe interference on a single line, relative to the reference potential ( fig. 1c ) 1.4.2 characteristics of interferences in order to be able to choose the correct emc measures, we need to know the characteristics of the interferences, how they are propagated and the mechanisms by which they are coupled into the cir- cuit. in principle, the interferences can also be classified according to their range ( fig. 2 ). at low fre- quencies, it can be assumed that the interference only spreads along conductive structures, at high frequencies only by means of electromagnetic radiation. in the mhz frequency range, the term cou- pling is generally used to describe the mechanism. analogously, conducted interference on lines at frequencies of up to several hundred khz are main- ly symmetrical ( differential mode ), at higher frequencies, they are asymmetrical ( common mode ). this is because the coupling factor and the effects of parasitic capacitance and inductance between the conductors increase with frequency. x capacitors and single chokes are suitable as suppression measures for the differential mode com- ponents. where asymmetrical, i.e. common-mode interference has to be eliminated, current-com- pensated chokes and y capacitors are mainly used, the prerequisite for this being, however, a well- designed, emc-compliant grounding and wiring system. the categorization of types of interference and suppression measures and their relation to the fre- quency ranges is reflected in the frequency limits for interference voltage and interference field strength measurements. fig. 2 frequency range overview pc ch. = iron powder core chokes, but also all single chokes/ x cap = x capacitors cc ch. = current-compensated chokes / y cap = y capacitors y cap cc ch. interference voltage 10 max. ratings 10 2 _ 10 1 _ characteristic interference propagation interference remedies pc ch. line differential mode x cap field strength 0 10 1 10 2 ssb1558-d mhz 10 3 shielding field field coupling ground common mode f general technical information
12 04/00 2 electromagnetic compatibility (emc) 2.1 introduction for as long as electronic transmission equipment such as radio, television, and telephone has been in existence, it has had a history of susceptibility to interference from other electronic devices. legal regulations on interference suppression (electromagnetic and radio frequency interference, emi and rfi) have been in existence since 1928. these regulations protect transmission paths and re- ception equipment by limiting the emitted interference. in view of the increasing number of electrical and electronic appliances in use, not only the princi- ples of interference suppression must be observed, but also, in the sense of electromagnetic com- patibility (emc), it must be ensured that all equipment is able to operate simultaneously without problems. emc is defined as the ability of electrical equipment to function satisfactorily in its elec- tromagnetic environment without affecting other equipment in this environment to an impermissible extent. the european communities emc directive (89/336/eec) came into force on the 1. 1. 1996. it has been transformed into corresponding legislation in the individual eu (european union) member states. with this, it has become mandatory to design electronic equipment to comply with the pro- tection objectives of this directive; i.e. to meet the requirements for electromagnetic emission and electromagnetic immunity as laid down in the corresponding en standards (european standards). the concept of emc includes both electromagnetic emission (eme) and electromagnetic immunity/ susceptibility (ems), see fig. 3 . fig. 3 emc terms an interference source may generate conducted or radiated electromagnetic energy, i.e. conducted emission (ce) or radiated emission (re). this also applies to the propagation paths and to the elec- tromagnetic susceptibility of disturbed equipment. in order to work out economical solutions, it is necessary consider both phenomena, i.e. propaga- tion and susceptibility, to an equal extent, and not just one aspect, e.g. conducted emission. emc = electromagnetic compatibility eme = electromagnetic emission ems = electromagnetic immunity/susceptibility ce = conducted emission cs = susceptibility to conducted emission re = radiated emission rs = susceptibility to radiated emission emc eme ems ce cs re rs emission susceptibility conducted radiated interference source disturbed equipment propagation general technical information
13 04/00 emc components are used to reduce conducted electromagnetic interference to the limits in an emc plan or to reduce this interference below the limit values specified in the emc regulations. these components may be installed either in the source of potential interference or in the disturbed equipment ( fig. 4 ). fig. 4 susceptibility model and filtering epcos offers emi suppression components with a well-balanced range of rated voltages and cur- rents for power supply lines as well as for signal and control lines. disturbed equip- ment power supply interference currents control line signal line sa re ce ce ce ce ce ce source ce re filter re re re interference voltages electric field magnetic field electromagnetic field general technical information
14 04/00 2.2 interference sources and disturbed equipment interference source an interference source is an electrical device or electrical equipment which emits electromagnetic interference. we can differentiate between two main groups of interference sources corresponding to the type of frequency spectrum emitted ( fig. 5 ). fig. 5 sources of interference interference sources with discrete frequency spectra (e.g. high frequency generators and micro- processor systems) emit interference energy which is concentrated on narrow frequency bands. switchgear and electric motors in household appliances, however, distribute their interference en- ergy over broad frequency bands and are considered to belong to the group of interference sources having a continuous frequency spectrum. m p systems switchgear (contactors, relays) rf generators household appliances medical equipment gas discharge lamps data processing systems power supplies and battery chargers microwave equipment ignition systems ultrasonic equipment welding apparatus rf welding apparatus motors with brushes radio and tv receivers oscillating drives switch-mode power supplies atmospheric discharges frequency converters ups systems electronic ballast circuits interference source (emission) discrete frequency spectrum (sine-wave, low energy) continuous frequency spectrum (impulses, high energy) general technical information
15 04/00 disturbed equipment electrical devices, equipment and/or systems subject to interference and which can be adversely affected by it are termed disturbed equipment. in the same way as interference sources, disturbed equipment can also be categorized correspond- ing to frequency characteristics. a distinction can be made between narrowband and broadband susceptibility ( fig. 6 ). narrowband systems include radio and tv sets, for example, whereas data processing systems are generally specified as broadband systems. fig. 6 disturbed equipment 2.3 propagation of electromagnetic interference and emc measurement techniques as previously mentioned, an interference source causes both conducted and radiated electro- magnetic interference. propagation along lines can be detected by measuring the interference current and the interference voltage ( fig. 7 ). the effect of magnetic and electric interference fields on their immediate vicinity is assessed by measuring the radiated magnetic and electric field components. this method of propagation is also frequently termed electric or magnetic coupling (near field). in higher frequency ranges, characterized by the fact that device dimensions are in the order of magnitude of the wavelength under consideration, the interference energy is mainly radiated direct- ly (far field). conducted and radiated propagation must also be taken into consideration when measuring the susceptibility of disturbed equipment. interference sources e.g. sine-wave generators as well as pulse generators with a wide variety of pulse shapes are used for such tests. radio and tv receivers digital and analog systems radio reception equipment data processing systems modems process control computers data transmission systems control systems telemetric radio transmission devices video transmission systems frequency-coded signalling equipment interface lines disturbed equipment (affected by emi) narrowband susceptibility broadband susceptibility general technical information
16 04/00 fig. 7 propagation of electromagnetic interference and emc measurement techniques 2.4 emc regulations und legislation a wide range of legislation and of harmonized standards have come into force and been published in the field of emc in the past few years. in the european union, the emc directive 89/336/eec of the council of the european communites has come into effect on the 1st of january 1996. as of this date, all electronic equipment must comply with the protection objectives of the emc directive. the conformity with the respective standards must be guaranteed by the manufacturer or importer in the form of a declaration of conformity. a ce mark of conformity must be applied to all equipment. as a matter of principle, all electrical or electronic equipment, installations and systems must meet the protection requirements of the emc directive and/or national emc legislation. a declaration of conformity by the manufacturer or importer and a ce mark are required for most equipment. excep- tions to this rule and special rulings are described in detail in the emc laws. new, harmonized european standards have been drawn up in relation to the eecs emc directive and the national emc laws. these specify measurement procedures and limit values or test sever- ities, both for interference emission and for the interference susceptibility (or rather, immunity to in- terference) of electronic devices, equipment and systems. the subdivision of the european standards into various categories (cf. following table) makes it easier to find the rules that apply to the respective equipment. the generic standards always apply to all equipment for which there is no specific product family standard or dedicated product standard. the basic standards contain information on interference phenomena and general measuring methods. ssb0016-2 quelle breitbandantenne messempf?nger rahmenantenne netzzufhrung netz- nachbildung stabantenne nahfeldkopplung s i s u s tromwan dl er p s s h e s messempf?nger messempf?nger messempf?nger tastkopf spektrumanalysator speicheroszillograph transientenrekorder ssb0016-2 selective voltmeter spectrum analyzer storage oscilloscope transient recorder near field coupling broadband dipole antenna probe source line impedance loop antenna rod antenna selective voltmeter selective voltmeter v int i int p int e int h int selective voltmeter stabilization network h int = magnetic interference fields e int = electrical interference fields p int = electromagnetic interference fields (radiated emission) i int = interference current v int = interference voltage power supply current probe voltage general technical information
17 04/00 the following standards and regulations form the framework of the conformity tests: 1) is governed by the safety and quality standards of the product families. emc standards germany europe international generic standards define the emc environment in which a device is to operate according to its intended use emission residential industrial din en 50081-1 din en 50081-2 en 50081-1 en 50081-2 susceptibility residential industrial din en 50082-1 din en 50082-2 en 50082-1 en 50082-2 basic standards describe physical phenomena and measurement procedures basics din vde 0843 en 61000 iec 61000 measuring equipment din vde 0876 cispr 16-1 measuring emission methods susceptibility din vde 0877 en 61000-4-1 cispr 16-2 iec 61000-4-1 harmonics din vde 0838 en 60555-2 iec 61000-3-2 interference factors e.g. esd em fields burst surge injection din vde 0843-2 din vde 0843-3 din vde 0843-4 din vde 0843-5 din vde 0843-6 en 61000-4-2 en 61000-4-3 en 61000-4-4 en 61000-4-5 en 61000-4-6 iec 61000-4-2 iec 61000-4-3 iec 61000-4-4 iec 61000-4-5 iec 61000-4-6 product standards define limit values for emission and susceptibility ism equipment emission susceptibility din vde 0875 t11 1 ) en 55011 1 ) cispr 11 1 ) household emission appliances susceptibility din vde 0875 t14-1 din vde 0875 t14-2 en 55014-1 en 55014-2 cispr 14-1 cispr 14-2 lighting emission susceptibility din vde 0875 t15-1 din vde 0875 t15-2 en 55015-1 en 55015-2 cispr 15 iec 3439 radio and emission tv equipment susceptibility din vde 0872 t13 din vde 0872 t20 en 55013 en 55020 cispr 13 cispr 20 high-voltage systems emission din vde 0873 en 55018 cispr 18 ite equipment emission susceptibility din vde 0878 din vde 0878 en 55022 en 55022 cispr 22 cispr 22 vehicles emission susceptibility din vde 0879 din vde 0839 en 72245 cispr 25 iso 11451/ s2 general technical information
18 04/00 the following table shows the most important standards in the field of immunity to interference. the iec 1000 or en 61000 series of standards are planned as central emc standards into which all emc regulations (e.g. iec 801, iec 555) are to be integrated in the next few years. 2.5 propagation of conducted interference in order to be able to choose suitable interference suppression components, the way in which con- ducted interference is propagated needs to be known ( fig. 8 ). fig. 8 common-mode and differential-mode interference standard test characteristics phenomena conducted interference en 61000-4-4 iec 61000-4-4 5/50 ns (single impulse) 15 khz burst burst cause: switching processes en 61000-4-5 iec 61000-4-5 1,2 / 50 ms (open-circuit voltage) 8 / 20 ms (short-circuit current) surge (high-energy transients) cause: lightning strikes mains lines, switching processes en 61000-4-6 (env 50141) iec 801-6 1 v, 3 v, 10 v 150 khz 80 mhz high-frequency coupling narrow-band interference radiated interference en 61000-4-3 (env 50140) iec 801-3 3 v/m, 10 v/m 80 1000 mhz high-frequency interference fields electrostatic discharge (esd) en 61000-4-2 iec 61000-4-2 up to 8 kv 5 / 50 ns electrostatic discharge voltage dips, short interruptions and variations en 61000-4-11 iec 61000-4-11 0,4 v r 1 50 ms 0,7 v r optional v r = 0 10 ms electrostatic discharge c p : parasitic capacitance r : resistance common-mode interference current differential-mode interference current interference source disturbed equipment general technical information
19 04/00 an interference source which is at a floating potential primarily emits differential-mode, i.e. symmet- rical interference which is propagated along the connected lines. on power lines, the interference current will flow towards the disturbed equipment on one wire and away from it on the other wire, just as the mains current does. symmetrical or differential-mode interference occurs mainly at low frequencies (up to several hundred khz). however, parasitic capacitances in interference sources and disturbed equipment or intended ground connections, also lead to an interference current in the ground circuit. this interference cur- rent flows towards the disturbed equipment through both the connecting lines and returns to the in- terference source through the ground lines.the currents on the connecting lines are in common mode and the interference is thus designated as common-mode or asymmetrical interference. since the parasitic capacitances will tend towards representing a short-circuit with increasing fre- quencies and the coupling to the connecting cables and the equipment itself will increase corre- spondingly, common-mode interference becomes dominant at multiple-mhz frequencies. in european usage, the concept of an unsymmetrical interference is used, in addition to the two components described above, to describe interference. this term is used to describe the interfer- ence voltage between a line and reference ground potential. 2.6 filter circuits and line impedance interference suppression filters are virtually always designed as reflecting lowpass filters, i.e. they reach their highest insertion loss when they are - on the one hand - mismatched to the impedance of the interference source or disturbed equipment and - on the other hand - mismatched to the im- pedance of the line. possible filter circuits for various line, interference source and disturbed equip- ment impedance conditions are shown in fig. 9 . fig. 9 filter circuits and impedance relationships line impedance of impedance source of interference / disturbed equipment low high high high high high unknown unknown low low low low unknown unknown general technical information
20 04/00 it is, therefore, necessary to find out the internal impedances so that optimum filter circuit designs as well as economical solutions can be implemented. the internal impedances of the power networks under consideration are usually known from calcu- lations and extensive measurements, whereas the impedances of interference sources or disturbed equipment are, in most cases, not or only inadequately known. for this reason, it is impossible to design the most suitable filter solution without measuring the equipment characteristics. in this context, we offer all our customers the competent assistance of our skilled staff, both on-site and in our emc laboratory in regensburg (also see chapter on ser- vices offered, page 32 ). 3 selection criteria for emc components to comply with currently valid regulations, a frequency range of 150 khz to 1000 mhz has to be taken into consideration, in most cases, in order to ensure electromagnetic compatibility; in addition, however, factors such as low-frequency line interference should be considered. emc components must thus have favorable rf characteristics and are ususally required to be ef- fective over a broad frequency range. for individual components (inductors) the rf characteristics are specified by stating the impedance as a function of frequency. 4 arrangement of emc components when designing filter circuits using individual components, observe the following basic rules: n the components should be arranged along the lines (see example in fig. 10 ) to avoid capacitive and inductive coupling between components and between filter inputs and outputs. n as insertion loss of a filter circuit in the mhz range is mainly determined by the capacitors con- nected to ground, the connecting leads of these capacitors should be as inductance-free as pos- sible, i.e. short. n filter circuits which are to be installed in devices with limited space must be shielded. fig. 10 correct arrangement of filter components, e.g. on a pc board choke int general technical information
21 04/00 when using off-the-shelf filters, observe the following rules: n ensure a proper electrically conductive connection between the filter case and/or filter ground and the metallic case of the interference source or disturbed equipment, and n provide sufficient rf decoupling between the lines at the filter input (line causing the interfer- ence) and the filter output (filtered line), if necessary by using shielding partitions. 5 approvals all products by epcos ag are basically designed to conform to the german vde regulations and/or en standards. the respective regulations or standards are given for each component type. many of our components have also been approval-tested in accordance with national and interna- tional regulations. the approval marks and quality assurance marks are listed in the data sheets. examples of approval marks: example of a quality assurance mark: in future, chokes will be tested in accordance with the new european standard en 138 100. a uni- form european mark of conformity has not yet been defined. for the time being the national marks of conformity are used (e.g. vde) and the corresponding european standards is stated beside the mark. 6 safety regulations when selecting emc components C in particular in case of power line applications C the safety reg- ulations applicable to the relevant equipment must be observed. vde germany ul usa cecc quality assurance mark general technical information
22 04/00 7 electrical characteristics 7.1 rated voltage v r the rated voltage v r is the maximum ac or dc voltage which can be continuously applied to the component at temperatures between the lower category temperature t min and the upper category temperature t max . 7.2 test voltage v t the test voltage v t is the ac or dc voltage which may be applied to the component for the specified test duration in the course of final inspection (100% end of line testing). this test may be repeated once as an incoming goods inspection test. 7.3 rated current i r the rated current l r is ac or dc current at which the component may be continuously operated under the nominal operating conditions. for components with 1, 2 or 3 lines, the rated current is specified for simultaneous flow of a current of this value through all lines. during ac operation, higher thermal loads may be caused due to waveforms which deviate from a pure sine wave. where necessary, such cases must be taken into consideration. 7.4 overcurrent the rated current may be exceeded briefly. details on permissible currents and load duration can be obtained upon request. 7.5 pulse handling capability saturation effects (e.g in the ferrite cores used) may occur when high-energy pulses are applied to the components and these may lead to impaired interference suppression. the maximum permis- sible voltage-time integral area is used to characterize the pulse handling capability of chokes. for standard components a range from 1 to 10 mvs can be assumed. more specific data can be ob- tained upon request. 7.6 current derating i op / i r at ambient temperatures above the operating temperature stated in the data sheet, the operating current must be reduced according to the derating curve. 7.7 rated inductance l r the rated inductance l r is the inductance which has been used to designate the choke, as measured at the frequency f l . general technical information
23 04/00 7.8 stray inductance l s the stray inductance l s (also termed leakage inductance) is the inductance measured through both coils when a current-compensated choke is short-circuited at one end. this affects symmetri- cal interference. fig. 11 stray inductance 7.9 inductance decrease d l / l 0 the inductance decrease d l / l 0 is the drop in inductance at a given current relative to the initial inductance l 0 measured at zero current. the data sheets specify this as a percentage. this de- crease is caused by the magnetization of the core material, which is a function of the field strength, as induced by the operating current. generally the decrease is less than 10 % . 7.10 dc resistance r typ , r min , r max the dc resistance is the resistance of a line as measured using direct current at a temperature of 20 c, whereby the measuring current must be kept well below the rated current. r typ typical value r min minimum value r max maximum value 7.11 winding capacitance, parasitic capacitance c p parasitic capacitances ( c p ), which impair the rf characteristics of the components, are related to the component geometry. these capacitances may affect the two lines mutually (symmetrically) as well as the line-to-ground circuit (asymmetrically). the design of all emc components supplied by epcos minimizes the parasitic effects. due to this, these components have excellent interference suppression characteristics right up to high frequencies. 7.12 quality factor q the quality factor q is the quotient of the imaginary component of the impedance divided by the real component. 7.13 measuring frequencies f q , f l f q is the frequency for which the quality factor q of a choke is specified. f l is the frequency at which the inductance of a choke is determined. general technical information
24 04/00 7.14 insertion loss the insertion loss is a criterium for the effectivity of interference suppression components, as measured by using a standardized measurement circuit ( fig. 12 ). fig. 12 definition of insertion loss the input terminals of the equipment under test are connected to an rf generator with impedance z (usually 50 w ) . at the output end of the component, the voltage is measured using a selective voltmeter having the same impedance z . the insertion loss is then calculated from the quotient of the no-load generator voltage v 0 and half the output voltage v 2 . insertion loss measurement reference measurement u = v = voltage general technical information
25 04/00 8 mechanical properties 8.1 potting (economy potting, complete potting) we distinguish between economy potting and complete potting. economy potting is used to fix the the core and windings in the case and the windings on the core. this is an economical technique which enables a single resin casting procedure to be used. be- cause of this, most chokes supplied by epcos are produced using this method. complete potting is only required when the thermal conductitvity of economy potting is not adequate or if the customer has special demands. complete potting requires several process steps to ensure complete embedding of the core and the windings. 8.2 types of winding epcos uses different types of winding to suit the respective technical requirements: C single-layer winding C multilayer winding C random winding the different types of winding lead to different inductance characteristics, especially at high fre- quencies. single-layer winding: the winding pitch is equal to or greater than the wire diameter. the coil is wound in one direction only. the only capacitances (parasitic capacitances) are those between one turn to the next. in comparison to all other types of winding, this type of winding leads to the lowest possible capaci- tances and thus the highest resonance frequencies. economy potting complete potting 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1 19 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1 19 general technical information
26 04/00 multilayer winding: the winding pitch is equal to the wire diameter. the coil is wound with several layers. this leads to parasitic capacitances between the layers in addition to the turn-to-turn capacitances. in compari- son to all other types of winding, this type leads to the highest capacitances and thus the lowest resonance frequencies. random winding: the winding pitch is smaller than the wire diameter. the coil is wound in one direction only. this method of winding a coil does not permit the final position of a turn to be predetermined exactly. the cross section of this type of winding clearly shows a disorderly, random arrangement of the turns. this leads to the parasitic capacitances being only minimally greater than those achieved by single- layer winding, and the resonance frequencies are equal to those achieved by single-layer winding. 2 3 4 5 6 7 8 9 10 19 18 17 16 15 14 13 12 1 11 2 3 4 5 6 7 8 9 10 19 18 17 16 15 14 13 12 1 11 2 3 5 6 8 10 11 13 14 4 7 9 12 1 2 3 5 6 8 10 11 13 14 4 7 9 14 12 16 1 18 15 17 19 15 17 19 16 18 general technical information
27 04/00 8.3 rf characteristics of various types of winding figure 13 shows the relation between the impedance and the frequency for two chokes of equal in- ductance. one of the chokes has a two-layer winding and the other is randomly wound. the choke with random windings has a considerably higher first resonance frequency. the spurious resonanc- es are very much higher than 10 mhz. the impedance at frequencies above the first resonance fre- quency is approximately five times higher. this leads to better interference suppression at high frequencies. fig. 13 impedance | z | versus frequency f comparison between two-layer winding and random winding the rf characteristics of all chokes supplied by epcos are within the specifications and reproduc- ible, as the winding processes which we have developed for single-layer, multilayer and random winding ensure that the characteristics of the inductors produced display very little variation. the reproducibility of electrical characteristics of chokes is mainly determined by the production technique used. at epcos, coils are wound mainly by automatic machines (either fully or semi-au- tomated). this permits even complicated winding patterns to be produced in large production runs with very little variation in product characteristics. in fig. 14 , the impedance curves of several chokes, some wound manually and some by machine, are shown for comparison. with the random winding used in this comparison, the advantages of machine winding are clearly noticeable. random wdg. 2-layer wdg. general technical information
28 04/00 fig. 14 impedance | z | versus frequency f reproducibility and scatter achieved by manual and by machine winding techniques. 9 climatic characteristics 9.1 upper and lower category temperature t max and t min the upper category temperature t max und the lower category temperature t min are defined as the highest and the lowest permissible ambient temperatures, respectively, at which the component can be operated continuously. 9.2 rated temperature t r the rated temperature t r is defined as the highest ambient temperature at which the component may be operated under nominal conditions. 9.3 reference temperature for measurements unless otherwise specified in the data sheets, the reference temperature for all electrical measure- ments is 20 c in accordance with iec 60068-1. manually wound machine wound general technical information
29 04/00 9.4 iec climatic category lec 60068 -1, appendix a, defines a method of specifying the climatic category by three groups of numbers delimited by slash characters. 1st group of numbers: absolute value of the lower category temperature t min as test temperature for test aa (cold) in accordance with iec 60068-2-1 2nd group of numbers: upper category temperature t max as test temperature for test ba (dry heat) in accordance with iec 60068 -2-2 test duration: 16 h 3rd group of numbers: number of days denoting the test duration for test ca (damp heat, steady-state) in accordance with iec 60068-2-3 at (93 + 2/C 3) % rel. humidity and an ambient temperature of 40 c 10 sizes the sizes of surface-mount components are encoded using a four-digit coding system. the code differs depending on the standard which it is based on. the american eia standards require the length and width to be stated in hundredths of an inch, in european standards and in the iec draft standards, these dimensions are encoded in tenths of a millimeter. the following table sumarizes the sizes: length width (mm) eia iec/en 1,0 0,5 0402 1005 1,6 0,8 0603 1608 2,0 1,2 0805 2012 2,5 2,0 1008 2520 3,2 2,5 1210 3225 4,5 3,2 1812 4532 5,6 5,0 2220 5650 example: 55/085/56 C 55 c + 85 c 56 days general technical information
30 04/00 11 dangerous substances in components dangerous substances (as defined by the german regulation gefahrstoffverordnung) are only used in our production and to an extent where the state of the art leaves us no alternative. wherever possible, we replace them by materials with safe characteristics. where this is not possible, special staff entrusted with environmental protection and supervision of noxious materials monitor strict ad- herence to relevant laws and regulations in each of our factories. as part of these efforts to manufacture our products without using dangerous substances as far as possible, we can guarantee for all components presented in this data book that they do not contain the following materials and compounds: C acryl nitrile C aliphatic chlorinated organic componds C arsenic compounds C asbestos C lead carbonate and lead sulphide C halogenated dioxines and furanes C cadmium C chlorinated fluorocarbons (cfc), nor are they used in component manufacture. others, C formaldehyde C pentachlorophenol (pcb) C polychlorinated biphenyles (pcb) C polychlorinated terphenyles (pct) C mercury compounds C creosote C ugilec and dbbt (pcb substitutes) C organic tin compounds C vinyl chloride may be used in manufacture but the components do not contain these. the packaging of our components is generally suitable for esd areas and free of pollutants. full details are available from our sales offices. 12 disposal in the light of the facts stated above on the topic of dangerous substances, all components present- ed in this book can be disposed of without problems. most of our components will be accepted by the respective electronic scrap recycling companies for material recycling and/or thermal decom- positon. of course the corresponding local regulations must be observed. general technical information

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